Electroplating
Up to 12 inches/300mm wafers
Large panel size electroplating possible
DPC: Direct Plating Copper
Cu, Ni, Au, AuSn, etc. electroplating.
Electroless plating for non-conductors using sputtered seed layers
Cu TSV (Through Silicon Via) fill
Cu TGV (Through glass Via) fill
Conformal TSV (Through Silicon Via)/ TGV(Through Glass Via) plating
Metal and solder electroplating
Electroforming
Fabrication of 3D metal solid structures using polymer or resist structures formed by X-ray lithography.
X-ray lithography with electroforming and molding know as the LIGA process.
High aspect ratio structures
Diameter as small as 1um, as thin s 20um
Huge applications in life sciences with biocompatible materials
Materials: Ni, Pd-Ni, Ni-Co
Applications
Fabrication of Nickel molds/ masters for nanoimprinting/ injection molding
Microfilters
Micro meshes/ filters
Nebulizer for mist generation
Microlens array
Metal masks
Gratings
Micropore membranes
Microneedles
Microfluidic chips