Electroplating

  • Up to 12 inches/300mm wafers

  • Large panel size electroplating possible

  • DPC: Direct Plating Copper

  • Cu, Ni, Au, AuSn, etc. electroplating.

  • Electroless plating for non-conductors using sputtered seed layers

  • Cu TSV (Through Silicon Via) fill

  • Cu TGV (Through glass Via) fill

  • Conformal TSV (Through Silicon Via)/ TGV(Through Glass Via) plating

  • Metal and solder electroplating

Electroforming

Fabrication of 3D metal solid structures using polymer or resist structures formed by X-ray lithography.

  • X-ray lithography with electroforming and molding know as the LIGA process.

  • High aspect ratio structures

  • Diameter as small as 1um, as thin s 20um

  • Huge applications in life sciences with biocompatible materials

  • Materials: Ni, Pd-Ni, Ni-Co

  • Applications

  • Fabrication of Nickel molds/ masters for nanoimprinting/ injection molding

  • Microfilters

  • Micro meshes/ filters 

  • Nebulizer for mist generation

  • Microlens array

  • Metal masks 

  • Gratings

  • Micropore membranes

  • Microneedles 

  • Microfluidic chips