Dicing

Dicing

  • Standard wafer silicon dicing 4″, 6″, 8”, and 12” inches wafers

  • Standard glass dicing 4”, 6″, 8”, and 12” inches substrates

  • Large size glass dicing 300x400mm, 500x600mm,

  • Quartz, Alumina dicing

  • Diamond Scribing

  • SiC, AlN, InP Dicing

  • Thick glass dicing

  • Stealth laser Dicing

    • Dry process

    • No dust

    • No chipping

  • Stealth dicing of MEMS wafers with Polygon-shaped dies, such as hexagons and octagons

  • Backgriding before dicing can be possible

  • Metals Cu, SUS, Al, etc.

  • Inspection, chip sorting, tray packing