Dicing
Standard wafer silicon dicing 4″, 6″, 8”, and 12” inches wafers
Standard glass dicing 4”, 6″, 8”, and 12” inches substrates
Large size glass dicing 300x400mm, 500x600mm,
Quartz, Alumina dicing
Diamond Scribing
SiC, AlN, InP Dicing
Thick glass dicing
Stealth laser Dicing
Dry process
No dust
No chipping
Stealth dicing of MEMS wafers with Polygon-shaped dies, such as hexagons and octagons
Backgriding before dicing can be possible
Metals Cu, SUS, Al, etc.
Inspection, chip sorting, tray packing