Packaging & Assembly

We offer a range of packaging and assembly solutions to cater to diverse needs.

  • Wafer backgrinding

  • Wafer dicing

  • Die bonding

    • Paste material: Epoxy Silicon

  • Wire bonding

    • Wire material: Au, Al, Cu  (18 to 500um)

  • Flip chip bonding

    • Bump formation: electroplating/ electroless plating

    • NiSn, NiAu, AuSn, NiPd, SnAg

  • BEOL (Back End of Line) Process

    • Dielectric growth

    • Dielectric trench etching

    • Burial copper electroplating

    • Cu CMP (Polishing)

  • Packaging for 3D/2.5D IC integration 

    • TSV fabrication for advanced packaging

    • TSV (Through Silicon Via )/ TGV (Through Glass Via) Interposer fabrication/ Polyimide film interposer

    • RDL’s (Redistribution Layers) fabrication

      • RDL fabrication with polymers as the passivation layer

      • BCB, PBO, Polyamide, Acrylic, etc., as a passivation layer

      • RDL fabrication with Cu damascene process: Both Single & Double Damascene process

    • TSV Reveal

    • UBM (Under Bump Metallization)

      • Electroless Nickel Plating (ENP)

      • Electroless nickel immersion gold (ENIG)

      • electroless nickel palladium gold plating layer (ENEPIG)

      • Ti/ Cu/Ni

      • Plated Cu

    • C4 Bumping

    • Cu post/pillar solder/ CuSn pillars/ AuSn/ SnAg

Packaging & Assembly