Accelerate Your Innovation, From Small-Lot Prototype to Volume Production
Precision fabrication from Japan, accessible to the world.
From substrate to diced chip.
Manufactured to exacting Japanese quality standards with experienced export logistics to all over the world.
4–11 weeks depending on process complexity, competitive with US and EU foundries.
NDA available on request. All projects handled with full confidentiality.
Your inquiry is reviewed personally by technical sales and process engineers within 1 business day.
We work with your team to develop and optimize non-standard processes. From novel materials to unique stack requirements, if it can be done in a cleanroom, we can scope it.
Multi-process flows combining lithography, deposition, etching, bonding, and TSV in a single coordinated project, no hand-offs between vendors.
We deliver complex multi-process fabrication by integrating lithography, deposition, etching, bonding, and TSV within a single coordinated workflow.
A complete workflow from substrate sourcing and mask fabrication to wafer processing, dicing, and global delivery coordinated under one project.
Our TSV/TGV and advanced packaging capabilities cover the full fabrication sequence, supporting 3D IC integration, through-glass via interposers, and MEMS-CMOS stacking.
Microfluidic chips, lab-on-chip, biosensors, DNA sequencing substrates, implantable MEMS.
GaAs/GaN HEMTs, RF MEMS switches, SAW/BAW filters, 5G components.
MEMS accelerometers, gyroscopes, pressure sensors, tactile sensors.
SiC/GaN power devices, energy harvesting MEMS, photovoltaic test structures.
Silicon photonics, LIDAR, optical MEMS, infrared detectors, metalens fabrication.
High-reliability MEMS sensors, pressure transducers, inertial measurement units.
How to work with us
Email your project brief, process requirements, substrate, wafer size, quantities, and timeline. GDS/DXF files welcome but not required at this stage.
A process engineer reviews your design for compatibility and feasibility. You receive a detailed quote with process specs, timeline, and pricing within 7–10 business days.
Confirm process traveller and wafer specs. An NDA can be signed at this stage if preferred. Purchase order raised, fabrication is scheduled and begins.
All processes executed with regular status updates. Wafers inspected with CD-SEM, optical, and electrical test. Full inspection report provided.
Wafers diced to your specification. Individual chips packaged or mounted on carrier substrates per your requirements.
Cleanroom-packaged, tracked international shipping to your door. Standard lead time of 4–8 weeks inquiry to delivery, depending on process complexity.
Share your process requirements, substrate, and production volume. A Nanosystems JP Inc. engineer will respond within 1 business day. Full quote typically within 7–10 business days, subject to project complexity and NDA requirements.