Pure-Play Foundry Services
from Japan
From substrate sourcing to diced chips, semiconductor, MEMS, advanced packaging, and nano-microfabrication for customers worldwide.
Small-lot prototyping through production. Technical review within 24 hours of inquiry.
Precision fabrication from Japan, accessible to the world. Delivered with startup speed.
Your end-to-end fabrication flow
& Wafers
Mask
graphy
imprinting
Deposition
Patterning
plating
Implant
Grinding
Cleaning
Packaging
Deposition
Bump
Bump
Attach
C4
Stacks
Sealing
Contacts
Metallization
Access
Cells
Wafers
Technology
Bonding
Fabrication
Reveal
Fabrication
Fabrication
& Assembly
Packaging
Bump
Microfluidics
Packaging
Pure-play foundry advantages
Japanese precision, global reach
Manufactured to exacting Japanese quality standards with experienced export logistics serving customers worldwide.
Competitive lead times
Typically 4-8 weeks; multi-process flows up to 11 weeks. Competitive with US and EU foundries.
IP-protected engagement
NDA available on request. All projects handled with full confidentiality.
Engineer-to-engineer communication
Your inquiry is reviewed by technical sales and process engineers, with a feasibility answer within 24 hours and direct access to process expertise from day one.
Custom process development
We work with your team to develop and optimize non-standard processes. For non-standard materials and process stacks, our engineers assess feasibility and define a practical process flow where suitable processing capability is available.
End-to-end integration
Multi-process flows combining lithography, deposition, etching, bonding, and TSV in a single coordinated project. Substrate sourcing through to diced chip delivery, managed end to end by a dedicated project manager.
Fast response and flexibility
From quotation to start-up and specification changes, we respond with startup speed. Feedback is reflected within days, not weeks.
Small-lot accessibility
Innovation shouldn't be gated by volume. We support orders from a single wafer, with the same Japanese manufacturing precision and attention regardless of order size. The same for a university startup as for a Fortune 500.
Project transparency
You receive project status updates at each major process milestone, from photolithography through to dicing. You are never left wondering where your project stands.
Complete 3D integration flow from DRIE to bumped wafer
Our TSV/TGV and advanced packaging capabilities cover the full fabrication sequence, supporting 3D IC integration, through-glass via interposers, and MEMS-CMOS stacking.
Applications we serve
Life Sciences & Diagnostics
Microfluidic chips, lab-on-chip, biosensors, DNA sequencing substrates, implantable MEMS.
RF & Communications
GaAs/GaN HEMTs, RF MEMS switches, SAW/BAW filters, 5G components.
Robotics & Automation
MEMS accelerometers, gyroscopes, pressure sensors, tactile sensors.
Energy & Power
SiC/GaN power devices, energy harvesting MEMS, photovoltaic test structures.
Photonics & Imaging
Silicon photonics, LIDAR, optical MEMS, infrared detectors, metalens fabrication.
Automotive & Aerospace
High-reliability MEMS sensors, pressure transducers, inertial measurement units.
From inquiry to chips
How to work with us
Send your inquiry
Email your project brief, process requirements, substrate, wafer size, quantities, and timeline. GDS/DXF files welcome but not required at this stage.
Technical review & quote
A process engineer reviews your design for compatibility and feasibility. You receive a detailed quote with process specs, timeline, and pricing within 7-10 business days.
NDA & order confirmation
Confirm process traveler and wafer specs. An NDA can be signed at this stage if preferred. Purchase order raised, fabrication is scheduled and begins.
Fabrication & QC
All processes executed with regular status updates. Inspection is defined per project and may include optical inspection, CD-SEM, and electrical test. Inspection data are delivered as agreed for the program.
Dicing & packaging
Wafers diced to your specification. Individual chips packaged or mounted on carrier substrates per your requirements.
Worldwide delivery
Cleanroom-packaged, tracked international shipping to your door. Standard lead time of 4-8 weeks inquiry to delivery, depending on process complexity.
Start your project.
Response within 24 hours.
Share your process requirements, substrate, and production volume. A Nanosystems JP Inc. engineer will respond within 24 hours. Full quote typically within 7-10 business days, subject to project complexity and NDA requirements.