TSV (Through Silicon Vias) Reveal
At Nanosystems JP, we provide backside TSV Cu reveal fabrication services.
Typical process is described below.
After SiN/SiO2 CMP, RDL fabrication followed by UBM and the C4 bumping is performed. More Information here.
Contact us today to learn more about our TSV Reveal services and to get started on your project.