Annealing Services for Advanced Material Applications
Annealing is pivotal for enhancing the performance, reliability, and refining silicon's intrinsic properties. Our specialized services ensure:
Stress relief in Silicon
Effective activation and movement of dopants.
Defect reduction.
Film densification for superior deposition outcomes.
Our Annealing Services Include:
Annealing Under Nitrogen (N2)
Benefit from a controlled nitrogen atmosphere that enhances material properties without oxidation issues.
Annealing Under Hydrogen (H2)
Experience reduced defect density and increased electrical performance through hydrogen-based annealing. Ensuring uniformity and desired material transformations.
Vacuum Annealing
Our vacuum annealing process minimizes the possibility of contaminant incorporation, leading to high-quality end products also for precise dopant activation and defect management.
Rapid Thermal Annealing (RTA)
Leverage our advanced RTA services that reach temperatures up to ~2000°C under argon or nitrogen atmospheres for rapid yet precise material modifications.
Silicon Carbide (SiC) Wafer Annealing
Optimize your SiC wafers with our dedicated annealing service tailored for silicon carbide materials.
Carbon Cap Annealing for SiC Wafers
A specialized process to significantly reduce surface roughness and improve your SiC wafer's overall quality and performance.
Trust in our expertise for all your annealing needs. Our annealing solutions deliver quality, reliability, and efficiency.
Contact us today to discuss your specific annealing needs.