Photolithography

Photolithography, a cornerstone in the fabrication of semiconductor and MEMS devices, begins with the intricate process of patterning on a wafer. This technique utilizes UV light to accurately transfer designs from a photomask onto a wafer coated with a photosensitive chemical resist. Our state-of-the-art photolithography capabilities enable us to create precise patterns, ranging from just a few nanometers to several micrometers in size.

We also specialize in large-size photolithography, adeptly handling glass substrates of approximately 500x600mm. This versatility in scale ensures that we can meet a wide range of fabrication needs, from the smallest components in microelectronics to larger substrates used in various applications.

Photolithography

Exposure

Process

Min Pattern size

Substrate size 

Remarks

Ebeam lithography

20nm

～up to 8 inches

  

Nanoimprinting 

50nm

～8 inches

Thermal &UV nanoimprinting 

KrF lithography

50nm

～12 inches

  

Stepper

4um

500x600mm

300x400mm

  

450nm

～8inches

Stepping accuracy of 60nm

Mask Aligner

4um

500x600mm

300x400mm

～12 inches

Front to backside alignment

We also offer advanced patterning techniques such as inkjet printing and screen printing, ideal for fabricating flexible printed circuits (FPC). Apart from above patterning can be done using shadow masks or metal masks

Large Size Photolithography on a Polymer Film

Polymer film: PET, PEN, Polycarbonates, etc.

  • Film Dimensions: 400x500mm

  • Pattern Resolution: L/S 3um/3um

  • Film Thickness Range: From a few micrometers up to 200μm

Photoresist Coating and Development

Both positive and negative photoresists can be used. Thin and thick coating is possible.

Photolithography

Thick photoresist thickness

Method of coating

  • Spin Coating

  • Spray coating

Organic Insulator/ Dielectric

Organic insulators available: SU-8, polyamide resin (PI), PBO, BCB, acrylic resin, etc.

Micron-level patterning on thick organic insulator.

3D Microstructure Fabrication via X-ray Lithography

At Nanosystems JP Inc., we specialize in 3D microstructure fabrication services using the advanced technique of X-ray lithography. This method is integral to the LIGA process (Lithographie, Galvanoformung, Abformung), allows creation of highly precise and intricate 3D microstructures. These include the fabrication of diverse shapes and forms, such as:

  • Pillars: Robust and finely detailed, suitable for various microscale applications.

  • Gratings: Precision-engineered for optimal performance in filtering and diffraction applications.

  • 3D Cones and Hemispheric Structures: Ideal for applications requiring geometric precision on a microscale.

Leverage our expertise in X-ray lithography combined with electroforming and molding to bring your most complex 3D microstructural designs to life.