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Nanosystems JP Inc.
Nanosystems JP Inc.
Home
Nano-Micro Foundry / Fabrication Services
MEMS & Semiconductor Foundry
Substrate/ wafers
Photolithography
Nanoimprinting
Thin Film Deposition
Etching
CMP & Wafer Grinding
Bonding
Annealing
Ion implantation
Electroplating
Dicing
Packaging & Assembly
Packaging for 3D/2.5D IC integration
TSV Fabrication
TSV Reveal
RDL Fabrication
TGV Fabrication
Application fields
Lifesciences & Biomedical
Photonics
Automotive
Biochip/ Microfluidics chip
Startup Support
About
Contact
English
Contact Us
Nanosystems JP Inc.
Nanosystems JP Inc.
Home
Nano-Micro Foundry / Fabrication Services
MEMS & Semiconductor Foundry
Substrate/ wafers
Photolithography
Nanoimprinting
Thin Film Deposition
Etching
CMP & Wafer Grinding
Bonding
Annealing
Ion implantation
Electroplating
Dicing
Packaging & Assembly
Packaging for 3D/2.5D IC integration
TSV Fabrication
TSV Reveal
RDL Fabrication
TGV Fabrication
Application fields
Lifesciences & Biomedical
Photonics
Automotive
Biochip/ Microfluidics chip
Startup Support
About
Contact
English
Contact Us
Home
Folder: Nano-Micro Foundry / Fabrication Services
Back
MEMS & Semiconductor Foundry
Substrate/ wafers
Photolithography
Nanoimprinting
Thin Film Deposition
Etching
CMP & Wafer Grinding
Bonding
Annealing
Ion implantation
Electroplating
Dicing
Packaging & Assembly
Packaging for 3D/2.5D IC integration
TSV Fabrication
TSV Reveal
RDL Fabrication
TGV Fabrication
Folder: Application fields
Back
Lifesciences & Biomedical
Photonics
Automotive
Biochip/ Microfluidics chip
Startup Support
About
Contact
English
Back
Contact Us

Nanosystems JP Inc. 株式会社ナノシステムズJP

Level 20, Marunouchi Trust Tower, 1-8-3 Marunouchi Chiyoda-Ku, Tokyo 100-0005 Japan

📞: +81 3-5288-5569

✉️: sales@nanosystemsjp.co.jp

🌐: www.nanosystemsjp.co.jp/

About

Who We Are
Contact Us

Services

Semiconductor & MEMS Pure-play Foundry Services

Biochip/ Microfluidics fabrication

Photolithography, Etching, Thin Film Deposition

CMP & Wafer Grinding, Bonding

Packaging for 3D/2.5D IC integration

TSV Fabrication, TGV Fabrication, TSV Reveal

Interconnects RDL Fabrication: Single / Double Damascene process