Thin Film deposition/ Coating/ Metallization
Sputtering
Different sputtering targets are available
Substate sizes can be from small-size wafers to 500x600 mm.
Metals
Al, Au, Ag, Pt, Cr, Cu, Ni, Ru, etc.
Barrier layers: TiN, TaN, TiW, SiN, etc.
Adhesion layers: Ti, Cr, TiO2, etc.
Piezoelectric deposition
PZT (Lead zirconate titanate)
Lead-free piezoelectric KNN (Potassium Sodium Niobate)
Reactive magnetron sputtering
AlN, TiN
KTN potassium tantalate niobate thin film deposition (KTa1-xNbxO3)
Silicon-rich nitride (SiRiN) deposition
LiPON (Lithium phosphorus oxynitride) deposition
Hydrogenated amorphous silicon
N-doped
P-doped
Non-doped
Ebeam and Thermal Evaporation Deposition
Gold evaporation deposition
Deposition of Al, Ag, Ti, Cr, Cu, Sn, Pt, etc.
AuSn solder (layered deposition) for UBM (Under Bump Metallization)
Thermal Oxide film
15 to 20um thermal oxide film thickness
Wet thermal oxide
Dry thermal oxide
ALD (Atomic layer deposition) deposition
Al2O3
SiO2
TiO2
ZrO2
Ion plating or Ion plating deposition
Ion Plating, a premier Physical Vapor Deposition (PVD) technique, harnesses the synergy of vacuum technology, material evaporation, and ion bombardment to craft durable and pristine metal or compound layers on various substrates.
Optical coating
MgF2
Ta2O5
Al2O3
CVD (Chemical Vapor Deposition)
LPCVD (Low-pressure chemical vapor deposition) oxide (LTO, SG/PSG, TEOS)
LPCVD poly-silicon deposition
LPCVD amorphous Silicon deposition
Low-temperature polycrystalline silicon (LTPS)
Cladding oxide deposition
PECVD (Plasma-enhanced chemical vapor deposition)
Dielectric oxide deposition: SiO2
nitride: SiN silicon nitride film
oxynitride
amorphous silicon
hydrogenated amorphous silicon ( α-Si: H)
TEOS
DLC (Diamond Like Carbon)
PSG (phosphosilicate glass deposition)
NSG (Non-doped Silicate Glass)
PECVD SiN
Low temperature
Low stress
Application waveguide
Epitaxial Growth/Deposition
GaN epitaxy
AlN epitaxy
Ion-assisted e-beam deposition (IBAD)
Optical coating
MgF2
Ta2O5
Al2O3
Roll to Roll Film/ Foil Deposition
Deposition on various film rolls
PET
Polyimide
Polycarbonate
Foils: Aluminium, Copper, Steel
Length of more than 5000m with a Width of more than 1000mm
Roll-to-roll deposition of metals and non-metals oxides such as Au, Pt, Ni, Cu, ITO, Cr, SiO2, Si, etc.
Method of deposition Sputtering, E-beam evaporation
Silicon (amorphous silicon deposition) on the Copper foil as anode for lithium-ion batteries
Thin film deposition is the specialized process of applying a thin layer of material onto a substrate, with thicknesses ranging from fractions of a nanometer to several micrometers. These films can be conductive or non-conductive, organic or inorganic. The nature and quality of the deposition process are pivotal for the performance, reliability, and lifetime of many devices. The choice of deposition method often depends on the desired film properties, the material being deposited, and the specific use-case scenario. They modify the substrate's surface properties, potentially enhancing its electrical, optical, or mechanical attributes.
At Nanosystems JP Inc., we provide a wide variety of high-quality thin film deposition services with precision. Our expertise encompasses thicknesses ranging from just a few angstroms up to microns, catering to both circular and rectangular substrates of dimensions as large as 500x600mm. But our commitment to your project doesn't end at deposition. We further offer custom services in Patterning, Photolithography, Wet and Dry Etching, and Liftoff, ensuring a comprehensive solution tailored to your needs. Whether you require Physical Vapor Deposition (PVD) or Chemical Vapor Deposition (CVD), we have the technological prowess to meet your specifications.
Applications
Microelectronics: Essential for creating semiconductors, integrated circuits, MEMS, and more.
Photovoltaic Cells: Thin films like CdTe or CIGS provide alternatives to standard silicon solar cells.
Thin Film Batteries: Compact energy storage ideal for wearables, smart cards, and IoT devices due to their scalability and flexibility.
Display Tech: Key for LCDs, OLEDs, and related technologies.
Optics: Used for lens coatings, anti-reflection, mirrors, and filters.
Magnetic Storage: Crucial for data storage in thin magnetic films.
Protective Coatings: Boost hardness and resist wear, applied on tools and machinery.
Biomedical: Enhance implants and medical devices, aiding biocompatibility and drug release.
Sensors: Vital for gas detection, strain measurement, and other sensing functions.
Thermal Barriers: Guard sensitive parts in aerospace and automotive fields.
Photonics: Thin films manipulate light for specific optical effects.