CMP (Chemical Mechanical Polishing)

CMP

  • CMP (Chemical Mechanical Planarization or Polishing)

    • CMP of metals

    • CMP of insulators (including polyimide and other polymer layers)

  • CMP up to 12-inch wafers

  • Wafer Thinning

  • Wafer polishing

  • Pre-bonding CMP

  • Optical grade polishing

  • Custom slurries for different CMP processes such as CMP for Cu (Damascene Process), Si wafer polishing slurry, SiC polishing slurry

  • CMP on Copper (Cu) RDL

Applications: Power devices, High-density packaging of IC, MEMS, etc.

Wafer Grinding

Wafer Grinding

  • From 4 inches to 12 inches

  • Grinding to a thickness of 50um

  • Backside grinding for TSV reveal

  • Grinding & polishing of SOI, SiC, sapphire, glass, MEMS wafers, etc.

  • Grinding of compound semiconductor wafers such as InP, GaAs, GaN, etc.

  • Grinding and polishing of Lithium tantalate (LiTaO3) for SAW applications

  • Inspection by wafer surface analyzer