Most hardware startups have the idea, the team, and even the funding.
But building MEMS sensors, photonic chips, or microfluidic devices requires access to multimillion-dollar cleanroom facilities and deeply experienced process engineers.
Nanosystems JP Inc. bridges that gap - providing advanced fabrication infrastructure and the expertise needed to turn complex designs into reality, giving you direct access to world-class fabrication without the overhead.
Developing a new MEMS pressure sensor, photonic biosensor, or SiC power chip requires ICP-RIE etchers, KrF steppers, PECVD systems, ion implanters, and packaging equipment. A single MEMS-capable cleanroom costs $50–200M to build.
Nanosystems JP Inc. gives you access to these capabilities from your very first wafer.
Knowing which etch recipe produces the right MEMS sidewall angle, which barrier layer prevents Cu diffusion into your dielectric, or which anneal temperature activates dopants without moving them, this process knowledge takes years to develop. Our engineers bring this knowledge to your project from the first consultation.
Large foundries typically quote 6–18 months for a new process flow. For a standard 3–4 photomask MEMS or photonic process, Nanosystems JP Inc. delivers first prototype wafers in under 45 days. Fast iteration matters more than anything else in early-stage hardware development, each design loop teaches you more than any simulation.
Pure-play foundry model: we do not design, manufacture, or sell devices that compete with our customers. Your design files, process specifications, mask layouts, and device performance data remain confidential under NDA. We do not share customer information between projects. Japan-based IP protection with strong legal framework.
Located in Tokyo, serving global customers entirely in English. Technical consultation, process quotation, engineering support, and project updates all in English. No translation overhead or cultural barrier between your device concept and the engineers who fabricate it.
Start with 1–5 prototype wafers. Move to 10–25 engineering lot wafers for design verification. Scale to production volumes when your design is locked. The same process recipe scales without re-qualification. Your prototype data is your production baseline, no technology transfer, no re-spin.
Accelerometers, gyroscopes, pressure sensors, MEMS microphones, gas sensors, and MEMS mirrors. DRIE, thin film deposition, wafer bonding, and packaging, the full MEMS process flow. Ideal for IoT sensors, wearables, drones, AR/VR, and industrial sensing startups.
SOI waveguides, grating couplers, ring resonators, and AuSn laser flip-chip integration for optical communication, LiDAR, spectroscopy, and optical biosensing chips. For startups developing next-generation optical transceivers, photonic sensors, or integrated quantum photonic devices.
PDMS lab-on-chip for biotech startups developing point-of-care diagnostics, organ-on-chip platforms, DNA sequencing devices, or biosensors. 3–5 day PDMS prototype turnaround. Large-format glass for low-cost biosensor arrays. LSPR nanopore chips by NIL.
SiC MOSFET and GaN HEMT fabrication for power electronics startups developing EV chargers, solar inverters, motor drives, and industrial power conversion. Full SiC process flow: ion implantation, high-temperature annealing, gate oxide, metallisation, and packaging.
GaAs, InP, and GaN MMIC fabrication for RF startup developing 5G/6G front-end modules, satellite communication chips, or mmWave radar sensors. Precise gate length lithography, ohmic contact annealing, and BCB low-k passivation for mmWave performance.
If your device requires semiconductor-grade cleanroom fabrication and does not fit neatly into the categories above, contact us. We have fabricated devices for quantum computing, metamaterial research, MEMS energy harvesters, photonic neural networks, and more. If it needs a cleanroom, we can likely help.
If you prefer to share design files, device schematics, or process requirements under NDA, we can arrange one before any details are exchanged - just mention it in your first message. Initial inquiries can proceed without one. We can schedule a technical consultation at any stage. No commitment required for the first discussion.
Our engineers identify the process flow that achieves your device specifications within your timeline and budget. We quote the full flow, not just individual process steps. Transparent pricing with no hidden fees for standard processes.
For lithography-based processes, we review your mask design for DRC (design rule compliance), alignment mark placement, and dicing street width before mask fabrication begins. Catching design issues before mask-out saves weeks.
Fabrication begins. You receive weekly progress updates with process data (etch depth, film thickness, CD measurements) at each key step. Non-conformances are reported immediately, not discovered at final test.
First prototype wafers delivered with a complete process data sheet. If the device performance requires process adjustment, we iterate on the same wafers or a new 1-wafer run, same recipe, fast turnaround, no minimum lot penalty.
When your design is locked and performance verified, scale to engineering lot (10–25 wafers) then production. Same process recipe. No technology transfer. Your prototype data is your production baseline.
Every process we offer is available from a single prototype wafer. No 25-wafer minimum lot. No engineering wafer fee that makes small-volume prototyping uneconomical. One wafer tells you whether your device concept works.
A standard 3–4 mask MEMS or photonic process delivers first prototype wafers in under 45 days. Not 6 months. Not 18 months. Fast enough to iterate 3–4 times in a year.
DRIE to PECVD to ion implant to wafer bonding to TSV to packaging, all managed as one project. No sub-contractor coordination delays between process steps. One schedule, one project.
An NDA is available if you prefer to share technical information under a formal agreement. Your mask layouts, device structures, and process specifications remain confidential throughout and after the project regardless.
Technical support in English from engineers who understand device physics, not just sales coordinators who relay questions to engineers. Direct access to the people making your device.
Nanosystems JP Inc. does not design or sell semiconductor devices. We fabricate devices for our customers. Your product concept is safe here, we have no commercial incentive to develop competing devices.
Share your process requirements, substrate, and production volume, A Nanosystems JP Inc. engineer will respond within 1 business day. Full quote typically within 7–10 business days, subject to project complexity and NDA requirements.