At Nanosystems JP Inc., we specialize in comprehensive semiconductor, MEMS, and nano-fabrication foundry services , from substrate procurement through to diced chips, delivered worldwide.
We are a Japanese company based in Tokyo. At Nanosystems JP Inc., we offer wafer-level semiconductor, MEMS, and nano-micro fabrication prototyping and production solutions. We manage the process from substrate procurement through to the delivery of the final diced chip , offering tailored fabrication solutions spanning single-wafer prototyping to volume production.
Cleanroom fabrication to ISO standards, executed with the precision and attention to detail Japan is known for globally.
Substrate to diced chip : substrate procurement, all fabrication processes, dicing, and inspection under a single project.
Small-lot prototyping from 1–5 wafers with no prohibitive minimums. R&D through to production scale without changing foundry.
NDA available before you share any design details. Your technology stays protected from first contact to final delivery.
Dedicated process engineers , not just a quotation desk. Technical review, feasibility assessment, and ongoing project support.
Ships worldwide. Accessible to international customers with English-language project support.
Nanosystems JP Inc. is headquartered at Marunouchi Trust Tower , in the heart of Tokyo's business district, minutes from Tokyo Station.
Nanosystems JP Inc.
株式会社ナノシステムズJP
Level 20, Marunouchi Trust Tower
1-8-3 Marunouchi, Chiyoda-Ku
Tokyo 100-0005, Japan
✉ [email protected]
📞 +81-3-5288-5569
🌐 www.nanosystemsjp.co.jp
At Nanosystems JP Inc., we offer a complete range of front-end and back-end semiconductor processes , from bare substrate to fully packaged chip.
Substrate procurement, mask fabrication, photolithography (20nm–4µm), nanoimprinting, thin film deposition (100+ materials), electroplating, etching, annealing, ion implantation, CMP, and dicing.
TSV fabrication, TSV reveal, TGV fabrication, wafer bonding (8+ methods), RDL fabrication, UBM, C4 bumping, AuSn bump services for silicon photonics, and full packaging assembly.
Glass/silicon/polymer biochip fabrication, organ-on-chip, MEA devices, silicon photonics waveguide processing, LIGA electroforming, and roll-to-roll thin film deposition.
At Nanosystems JP Inc., a process engineer will review your inquiry personally. We respond within 1 business day, with a full quote typically within 7–10 business days, subject to project complexity and NDA requirements.
Process requirements, substrate type and size, production volume, and your target timeline. GDS/DXF files are not required at this stage.
An NDA can be arranged before any design files or technical details are shared - just mention it in your first message.
Initial response within 1 business day. Full quote within 7–10 business days once all project information is confirmed.