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株式会社ナノシステムズJP

⚙️ Capabilities Overview 🔷 Substrate & WafersSi, SiC, GaN, glass, sapphire 🔬 Fused Silica WafersQuartz · borosilicate · low CTE 🟣 PI Film & SUS Sensor FabRoll-to-roll · sensor patterning 🎭 Mask FabricationGDS to chrome mask, DRC 📷 PhotolithographyE-beam 20 nm to 500×600 mm 🔬 NanoimprintingUV & thermal NIL 🫧 Thin Film DepositionPVD, CVD, ALD, MBE ⬆️ LiftoffMetal pattern · shadow mask ⚡ ElectroplatingCu TSV fill, DPC, LIGA 🌊 EtchingICP-RIE, DRIE >50:1 🔥 AnnealingN₂ / H₂ / vacuum / RTA ⚛️ Ion ImplantationB / P / As / Al / N implant 🔄 CMP & GrindingCu CMP, 50 µm thinning 💎 DicingBlade, stealth laser 🧪 Wafer CleaningRCA, plasma, megasonic 🔗 Wafer BondingHybrid, eutectic, fusion 📌 TSV FabricationHigh AR, void-free Cu fill 👁️ TSV RevealBackgrind → etch → CMP 🪟 TGV FabricationThrough-glass via 🔀 RDL FabricationBCB / PBO / PI + damascene 📦 Packaging & AssemblyWire bond, flip-chip 📚 3D / 2.5D PackagingTSV + RDL + UBM + C4 🥇 AuSn BumpPVD lift-off, fluxless 🧬 Biochip & MicrofluidicsGlass 500×600 mm, NIL 🔆 SiPho PackagingTSV · RDL · UBM · C4 for PIC 🤖 AI & HPC PackagingCoWoS-style, 2.5D / 3D 💡 Silicon PhotonicsSOI · AuSn · TSV interposer 🚗 AutomotiveMEMS sensors, SiC power 🧬 Life SciencesLab-on-chip, biosensors 🔭 All Industries → Request a Quote →